FALCON 5/C Reflow Solder/ Curing Oven
1
2
機能・特性
- Temperature Accuracy ± 2°C
- Temperature (Standard) Up to 400°C
- Maximum Substrate Size 5 in. x 5.75 in. (125 x 144 mm)
- Coolant Flow 0.5 to 2 GPM (2 to 8 liters/min.)
- O2 Level 10 PPM, 0.25 inch opening
製品情報
-
MANUFACTURER
SIKAMA -
MANUFACTURING PROCESS
WLCSP -
Details
Reflow
